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    DSAZSAA00019041.pdf by NXP Semiconductors

    • Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT502A D A F 3 D1 U1 B q c C 1 H L E1 p U2 E w1 M A M B M A 2 w2 M C M
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    DSAZSAA00019041.pdf preview

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