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    DSAZSAA00019054.pdf by NXP Semiconductors

    • Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P
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    DSAZSAA00019054.pdf preview

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