DSAZSAA00019060.pdf by NXP Semiconductors

Partial File Text Package outline BGA316: plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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