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    DSAZSAA00019070.pdf by NXP Semiconductors

    • Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 25 A 24 37
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    DSAZSAA00019070.pdf preview

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