DSAZSAA00019072.pdf by NXP Semiconductors

Partial File Text Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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