DSAZSAA00019074.pdf by NXP Semiconductors
- Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b e
- Original
- Unknown
- Unknown
- Unknown
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