DSAZSAA00019075.pdf by NXP Semiconductors

Partial File Text Package outline SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm D E SOT556-1 A X c y HE v M A Z 13 24 A2 A (A 3)
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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