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    DSAZSAA00019087.pdf by NXP Semiconductors

    • Package outline TFBGA180: thin fine-pitch ball grid array package; 180 balls SOT570-3 A B D ball A1 index area E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b
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    DSAZSAA00019087.pdf preview

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