DSAZSAA00019472.pdf by NXP Semiconductors

Partial File Text Package outline WLCSP6: wafer level chip-size package; 6 bumps (2 x 3) IP3319CX6 bump A1 index area D A1 E A detail X e b C e e1 B A 1 2 X 0 1 mm scale
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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