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    DSAZSAA00019492.pdf by NXP Semiconductors

    • Package outline HVQFN36: plastic thermal enhanced very thin quad flat package; no leads 36 terminals; body 6 x 6 x 0.85 mm SOT1092-1 B D D1 A terminal 1 index area E1 E A
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    DSAZSAA00019492.pdf preview

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