DSAZSAA00019512.pdf by NXP Semiconductors

Partial File Text Package outline HBGA432: plastic thermal enhanced ball grid array package; 432 balls; heatsink SOT1119-1 B D A D1 ball A1 index area E1 j E A2 A A1 detail X
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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