DSAZSAA00019534.pdf by NXP Semiconductors

Partial File Text Package outline HBGA360: plastic, thermal enhanced ball grid array package; 360 balls; heatsink SOT1163-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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