DSAZSAA00019541.pdf by NXP Semiconductors

Partial File Text Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-1 D A E X c y exp
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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