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    DSAZSAA00019551.pdf by NXP Semiconductors

    • Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-1 c y X exposed die pad A Dh 36 25 37 24
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    DSAZSAA00019551.pdf preview

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