DSAZSAA00019552.pdf by NXP Semiconductors

Partial File Text Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 x 10 x 1 mm; exposed die pad SOT1181-2 c y X exposed die pad A Dh 36 25 37 24
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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