DSAZSAA00019568.pdf by NXP Semiconductors
- Package outline DFN2626-10: plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals; body 2.6 x 2.6 x 0.5 mm SOT1197-1 X A B D A E A1 A3 termi
- Original
- Unknown
- Unknown
- Unknown
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