DSAZSAA00019775.pdf by NXP Semiconductors

Partial File Text Wave soldering footprint Footprint information for wave soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 6.30 4.90 2.70 1.90 2.90 1.70 solder land
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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