DSAZSAA00019777.pdf by NXP Semiconductors

Partial File Text Wave soldering footprint Footprint information for wave soldering of SO8 package SOT96-1 1.20 (2Ã) enlarged solder land 0.3 (2Ã) 0.60 (6Ã) 1.30 4.00 6.60 7.00 1.27 (6Ã
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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