DSAZSAA00019797.pdf by NXP Semiconductors
- Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm SOT631-3 B D A ball A1 index area A A2 A1 E detail X C
- Original
- Unknown
- Unknown
- Unknown
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