DSAZSAA00019802.pdf by NXP Semiconductors
- Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D1 ball A1 index area j A E1 E A2
- Original
- Unknown
- Unknown
- Unknown
-
Powered by
Findchips
