DSAZSAA00019802.pdf by NXP Semiconductors

Partial File Text Package outline HBGA596: plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink SOT635-1 B D A D1 ball A1 index area j A E1 E A2
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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