DSAZSAA00019808.pdf by NXP Semiconductors

Partial File Text Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 7
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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