DSAZSAA00019810.pdf by NXP Semiconductors

Partial File Text Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm D B b A SOT639-2 v M C A B w M C f terminal 1 index area v M C A B
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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