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    DSAZSAA00019813.pdf by NXP Semiconductors

    • Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C
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    DSAZSAA00019813.pdf preview

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