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    DSAZSAA00019825.pdf by NXP Semiconductors

    • Package outline FCP2: metal flip chip package; 2 leads; 35 mm wide tape SOT732-1 underfill tape A backside tape detail X X reject hole by device testing direction mark underfill
    • Original
    • Unknown
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    • Find it at Findchips.com

    DSAZSAA00019825.pdf preview

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