DSAZSAA00019830.pdf by NXP Semiconductors
- Package outline LFBGA64: plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm D SOT744-1 A B ball A1 index area E A A2 A1 detail X C
- Original
- Unknown
- Unknown
- Unknown
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