DSAZSAA00019887.pdf by NXP Semiconductors

Partial File Text Package outline HSSON18: plastic thermal enhanced shrink small outline package; no leads; 18 terminals; body 8 x 12 x 2.1 mm SOT810-1 X B D A E A A1 c terminal 1 index area
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSAZSAA00019887.pdf preview Download Datasheet