DSAZSAA00019888.pdf by NXP Semiconductors
- Package outline BGA256: plastic ball grid array package; 256 balls; body 17 x 17 x 1.2 mm SOT811-1 B D D1 A ball A1 index area A E1 E A2 A1 detail X C e1 e 1/2
- Original
- Unknown
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