DSAZSAA00019889.pdf by NXP Semiconductors
- Package outline BGA288: plastic ball grid array package; 288 balls; body 23 x 23 x 1.7 mm SOT812-1 B D D1 A ball A1 index area A2 A1 A E1 E detail X C e1 e 1/2 e
- Original
- Unknown
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