DSAZSAA00019901.pdf by NXP Semiconductors
- Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm SOT825-1 B D A ball A1 index area E A A2 A1 detail X C e1
- Original
- Unknown
- Unknown
- Unknown
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