DSAZSAA00019911.pdf by NXP Semiconductors

Partial File Text Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad SOT841-4 c y exposed die pad X Dh A 60 41 61 ZE
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSAZSAA00019911.pdf preview Download Datasheet