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    DSAZSAA00019922.pdf by NXP Semiconductors

    • Package outline HVQFN68: plastic thermal enhanced very thin quad flat package; no leads; 68 terminals; body 8 × 8 × 0.85 mm A B D SOT852-2 terminal 1 index area E A A1 c d
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    DSAZSAA00019922.pdf preview

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