DSAZSAA00019936.pdf by NXP Semiconductors
- Reflow soldering footprint 2.400 pa + oa 2.000 0.500 0.500 0.250 0.025 0.025 4.250 3.400 pa + oa 2.000 4.000 0.900 solder lands solder paste www.nxp.com © 200
- Original
- Unknown
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