DSAZSAA00019965.pdf by NXP Semiconductors
- Package outline TFBGA240: plastic thin fine-pitch ball grid array package; 240 balls; body 12 x 12 x 0.7 mm D B SOT868-1 A ball A1 index area A E A2 A1 detail X C e1
- Original
- Unknown
- Unknown
- Unknown
-
Powered by
Findchips
