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    DSAZSAA00019966.pdf by NXP Semiconductors

    • Package outline BGA288: plastic ball grid array package; 288 balls; body 27 x 27 x 1.55 mm D SOT869-1 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 e
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    DSAZSAA00019966.pdf preview

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