DSAZSAA00019993.pdf by NXP Semiconductors

Partial File Text Package outline HLQFN64R: plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.35 mm D B SOT903-2 A A terminal 1 index area
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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