DSA00444866.pdf by National Semiconductor

Partial File Text External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves a
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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40 lead ceramic flatpack ceramic pin grid array package lead finish ceramic pin grid array package lead finish gold EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES gold plate MIL-M38510 lead finish National Semiconductor 16 Pin Dip

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