DSA00200783.pdf by Motorola

Partial File Text Thermal Measurement Report Package Description: DATE: 5/8/96 revised 11/18/96 Package: 240 32 x 32 mm QFP Die Down Flag: 10.6 mm Square Leadframe: SIDN 1234625 Die Attach: JMI 2500AN Mold
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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