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    DSA0062897.pdf by STMicroelectronics

    • AN668 APPLICATION NOTE A New High Power IC Surface Mount Package Family: PowerSO-20TM & PowerSO-36 Power IC Packaging from Insertion to Surface Mount ing by P. Casati & C. Cognetti A new, high
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    AN668 an668 "pin compatible" FR4 substrate height and thickness LEAD FRAME SURFACE MOUNT MO-166 outline of the heat slug for JEDEC PowerSO weight 1.9 gr powerso-20 powerso-20 and pcb footprint powerso-36 and pcb footprint POWERSO20 POWERSO36 shape PSO-36 Referring to STMicroelectronics guideline "Thermal ST Microelectronics, mold compound
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