7498011001A datasheet by Wurth Elektronik

7498011001A Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the 7498011001A?
  The recommended PCB footprint for the 7498011001A is a rectangular pad with dimensions of 3.2mm x 1.6mm, with a 1.1mm diameter hole in the center for the component's pin.
• How do I ensure proper thermal management for the 7498011001A?
  To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB with a minimum size of 10mm x 10mm, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK.
• What is the maximum operating temperature range for the 7498011001A?
  The maximum operating temperature range for the 7498011001A is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
• Can the 7498011001A be used in high-vibration applications?
  Yes, the 7498011001A is designed to withstand high-vibration environments, with a vibration resistance of up to 10g (rms) in the frequency range of 10-2000 Hz.
• What is the recommended soldering process for the 7498011001A?
  The recommended soldering process for the 7498011001A is a reflow soldering process with a peak temperature of 260°C, and a dwell time of 30-60 seconds above 220°C.