The recommended PCB footprint for the 7448014501 is a rectangular pad with a size of 3.2 mm x 1.6 mm, with a 0.5 mm spacing between the pads.
To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum operating temperature range for the 7448014501 is -40°C to +125°C, with a storage temperature range of -40°C to +150°C.
Handle the 7448014501 by the body of the component, avoiding touching the pins or electrical contacts. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage.
The recommended reflow soldering profile for the 7448014501 is a peak temperature of 245°C, with a dwell time of 30-60 seconds above 220°C.