DSAZSAA0006416.pdf by Altera

Partial File Text Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical hand
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock
Powered by Findchips

DSAZSAA0006416.pdf preview

Download Datasheet

User Tagged Keywords

FC-BGA T0812012