DSA00446391.pdf by Siemens

Partial File Text s Semiconductors For the trade press Munich, September 1998 Siemens supplies world's thinnest wire-bond IC package for contactless chip cards With a maximum module thickness of 330 µm and ver
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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contactless INLAY MODULE ANTENNA CARDS MCC2 Package MCC2 Package siemens semiconductors Siemens Semiconductors

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