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Partial File Text BOTTOM VIEW PIN 1 I.D.- SEE DETAIL 'A' r 0|ddd (0)|C|A~B0|D0 LEAD FINISH: SOLDER PLATE T -C- .20 s Y M MILLIMETERS B â¡ L MIN, NDM, MAX, A 1,60 Ai 0,05 0,10 0,15 Aa 1,35 1,40 1,45 D/E 26,00 BSC
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EI-24 HT176 outline of the heat sink for JEDEC TQ176