DSA00333658.pdf by Samsung Electronics

Partial File Text Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers.
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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D 4242 FBGA PACKAGE thermal resistance pcb design 0,5 mm pitch Samsung 3232 STDH150

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