DSA00333676.pdf by Samsung Electronics

Partial File Text Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers.
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
Price & Stock Find it at Findchips.com

DSA00333676.pdf preview

Download Datasheet

User Tagged Keywords

12 x 12 fbga thermal resistance package tsop1 pcb design 0,5 mm pitch QFP PACKAGE thermal resistance

Price & Stock Powered by