Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSAUD005765.pdf by Xilinx

    • 0 Packages and Thermal Characteristics R February 2, 1999 (Version 2.1) 0 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages defin
    • Original
    • Unknown
    • Unknown
    • Unknown
    • Find it at Findchips.com

    DSAUD005765.pdf preview

    Price & Stock Powered by
    Supplyframe Tracking Pixel