DSAFRAZ00558.pdf by Xilinx

Partial File Text Xilinx Thermally Enhanced Packaging ® April 1996 Application Note The Package Offering Xilinx Code Body (mm) HQ304 HQ240 HQ208 THK (mm) Mass (gm) Heatsink Location JEDEC
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eftec eftec 64 EFTEC-64 HQ208 HQ240 leadframe C7025 OPQ0014 OPQ0019 OPQ0020 XC4013E XC4020E