DSAE0058268.pdf by Malico

Partial File Text Model : MBA27002 Series For 27x27 Chip set BGA Heat Sink MBA27002 Series Specification: 1.Material: Heat Sink : CU1100 Clip : Plastic (UL94-V0) 2.Heat sink dimension : Foot print : 27x2
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27X27MM bu series CU1100 MBA27002 plastic ul94v0