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DSA00336766.pdf
by Wolfson Microelectronics
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WAN-108 Moisture Sensitivity Classification and Plastic IC Packaging w Applications Note, November 2001, Rev 1.2 CONTENTS BRIEF SUMMARY ....................................................
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Unknown
Pb Free
Unknown
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User Tagged Keywords
delamination leadframe
J-STD-020A
JEP113-B
JESD22-A113-B
MIL-B-81705B
moisture sensitive handling and packaging
WAN-108
WOLFSON SUFFIX REV
WOLFSON SUFFIX V